disco corporation equipment for qrindinq of
About DISCO: DISCO HI-TEC EUROPE It is the right place for needs related to the sale or maintenance of any dicing machine and blades, grinding equipment, laser cutter, ,DISCO Corporation
Grinding is generally performed for wafer thinning, while polishing ensures a smooth and damage-free surface However, in most of the latest equipment, the grinding and polishing tasks are integrated into a single device, to overcome the ,
Grinders can thin silicon wafers, compound semiconductors, and many other types of materials with a high degree of accuracy Processing for applications which use the DBG system or DAF (Die attach film) is also possible by incorporating a polisher and wafer mounter with the grinder into an inline system*
disco corporation equipment for qrindinq of disco corporation equipment for qrindinq of Decemberlaunched MB5XPendulum Suspension Grinding Mill Besides the company was rated asannual innovative enterprise of the sand and gravel industry andannual excellent entrepreneur of the sand and gravel industry Get More info
DISCO HI-TEC EUROPE Dicing-Grinding Service Liebigstrasse 8 D-85551 Kirchheim b München Germany Phone +49 89 909 03-0 Fax +49 89 909 03-199 [email protected]
Disco Corp DISCO Corp engages in the manufacturing and sale of precision processing equipment It operates through the following business divisions: Precision Machines, Precision Processing .
See the company profile for DISCO CORPORATION (6146T) including business summary, industry/sector information, number of employees, business summary, corporate governance, key executives and .
Company profile for solar equipment manufacturer Disco Corporation - showing the company's contact details and products manufactured , Disco Disco Corporation 2 Chome-13-11 Omorikita, Ota-ku, Tokyo-to 143-0016 +81 3 45901111: discocojp , Wafer Grinding Equipment, Wafer Polishing Machine Last Update 15 Mar 2019 .
The ZHFX Series employs a bond that has ideal wear properties for processing newly developed oxide wafers It is capable of continuously processing oxide wafers, which has been difficult thus far, with a high level with stability
Grinding is generally performed for wafer thinning, while polishing ensures a smooth and damage-free surface However, in most of the latest equipment, the grinding and polishing tasks are integrated into a single device, to overcome the drawbacks of performing these operations separately
Description The Disco Automatic Grinder (DAG 810) Model 810 is a single-spindle/single-chuck-table unit that performs back-side grinding on sampl
Metal Cutting Corporation 7 Fundamentals of the Centerless Grinding Process 7 Fundamentals of the Centerless Grinding Process Where Machining Ends, Centerless Grinding Begins In the machining world, turning gets all the attention Lathes and mills are the flashy stars -- in fact, they ARE machining to most people However, the centerless grinding process is also very important
Disco Wafer Die Saws Disco Corporation manufactures a wide range of fully automatic and automatic Wafer Die Saw for cutting semiconductor wafers EquipNet carries a range of used Disco Corporation equipment, including fully automatic dicing saws
Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipmentInvestor relations, careers, and DISCO corporate ,
This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai) and DISCO HI-TEC AMERICA(San Jose) It is also possible to provide these services with machines that are not shown here
Dicing equipment; grinding equipment and related consumables for materials processing
Mar 30, 2009· DISCO Corporation (TOKYO:6146) provides equipment and process solutions to the semiconductor and electronics industries utilizing our core technologies of kiru (cutting), kezuru (grinding), and .
TO OUR SHAREHOLDERS 2 DISCO CORPORATION ANNUAL REPORT 2000 World Leadership Position in Precision Systems Products-“Kiru” (cutting), “Kezuru” (grinding) and “Migaku” (polishing) technologies DISCO’S PRECISION SYSTEMS PRODUCTS HOLD TOP SHARE IN THE WORLD
See the company profile for DISCO CORP Registered Shares o (D65SG) including business summary, industry/sector information, number of employees, business summary, corporate governance, key .
DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage .
disco corporation equipment for qrindinq of crusherasia DISCO Corporation Manufacturer of precision dicing saws and grinding wheels providing dicing, grinding, and polishing equipment and services for semiconductor and electronic components Get price
DISCO CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools, as ,
Disco Corporation manufactures and sells precision cutting, grinding, and polishing machin The Company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation
disco corporation equipment for qrindinq of KABRA｜DISCO Corporation This ingot slicing method forms a flat light-absorbing separation layer (KABRA layer *2) at a specified depth by irradiating a continuous, vertical laser from the upper surface of the SiC ingot, producing wafers Conventional laser processing is not suitable for slicing .
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This ingot slicing method forms a flat light-absorbing separation layer (KABRA layer *2) at a specified depth by irradiating a continuous, vertical laser from the upper surface of the SiC ingot, producing wafers Conventional laser processing is not suitable for slicing because the modified layer formed by laser irradiation, in principle, extends in the direction of the laser incident (vertical)
About DISCO CORPORATION DISCO CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools, as well as the .
DISCO Corp engages in the manufacturing and sale of precision processing equipment It operates through the following business divisions: Precision Machines, Precision Processing Tools, and Other .
DISCO's grinding wheels grind silicon, compound semiconductors, crystals, and a wide variety of other materials They are an essential part of DISCO's excellent Kezuru (Grinding) solutions
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