disco corporation equipment for qrindinq of

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disco corporation equipment for qrindinq of

disco corporation equipment for qrindinq of

About DISCO: DISCO HI-TEC EUROPE It is the right place for needs related to the sale or maintenance of any dicing machine and blades, grinding equipment, laser cutter, ,DISCO Corporation

Semiconductor Wafer Polishing and Grinding Equipment ,

Semiconductor Wafer Polishing and Grinding Equipment ,

Grinding is generally performed for wafer thinning, while polishing ensures a smooth and damage-free surface However, in most of the latest equipment, the grinding and polishing tasks are integrated into a single device, to overcome the ,

Product Information | Grinder and Polisher - DISCO Corporation

Product Information | Grinder and Polisher - DISCO Corporation

Grinders can thin silicon wafers, compound semiconductors, and many other types of materials with a high degree of accuracy Processing for applications which use the DBG system or DAF (Die attach film) is also possible by incorporating a polisher and wafer mounter with the grinder into an inline system*

disco corporation equipment for qrindinq of

disco corporation equipment for qrindinq of

disco corporation equipment for qrindinq of disco corporation equipment for qrindinq of Decemberlaunched MB5XPendulum Suspension Grinding Mill Besides the company was rated asannual innovative enterprise of the sand and gravel industry andannual excellent entrepreneur of the sand and gravel industry Get More info

DISCO dicing saws and quality equipment - dicing-grinding ,

DISCO dicing saws and quality equipment - dicing-grinding ,

DISCO HI-TEC EUROPE Dicing-Grinding Service Liebigstrasse 8 D-85551 Kirchheim b München Germany Phone +49 89 909 03-0 Fax +49 89 909 03-199 [email protected]

6146 Stock Price | Disco Corp Stock Quote (Japan: Tokyo ,

6146 Stock Price | Disco Corp Stock Quote (Japan: Tokyo ,

Disco Corp DISCO Corp engages in the manufacturing and sale of precision processing equipment It operates through the following business divisions: Precision Machines, Precision Processing .

DISCO CORPORATION (6146T) Company Profile & Facts

DISCO CORPORATION (6146T) Company Profile & Facts

See the company profile for DISCO CORPORATION (6146T) including business summary, industry/sector information, number of employees, business summary, corporate governance, key executives and .

Disco Corporation | Production Equipment | Japan

Disco Corporation | Production Equipment | Japan

Company profile for solar equipment manufacturer Disco Corporation - showing the company's contact details and products manufactured , Disco Disco Corporation 2 Chome-13-11 Omorikita, Ota-ku, Tokyo-to 143-0016 +81 3 45901111: discocojp , Wafer Grinding Equipment, Wafer Polishing Machine Last Update 15 Mar 2019 .

Dicing Blades | ZHFX Series - DISCO Corporation

Dicing Blades | ZHFX Series - DISCO Corporation

The ZHFX Series employs a bond that has ideal wear properties for processing newly developed oxide wafers It is capable of continuously processing oxide wafers, which has been difficult thus far, with a high level with stability

MISUZU INDUSTRIES CORPORATION » Equipment

MISUZU INDUSTRIES CORPORATION » Equipment

私たちミスズ工業は、腕時計の部品製造で培った超小型・薄物部品のプレス加工の技術を活かし、微細かつ複雑な金型の設計・製作からプレス加工、表面処理に至る自社一貫製造体制により、多様なニーズにお応えします。

Semiconductor Wafer Polishing and Grinding Equipment ,

Semiconductor Wafer Polishing and Grinding Equipment ,

Grinding is generally performed for wafer thinning, while polishing ensures a smooth and damage-free surface However, in most of the latest equipment, the grinding and polishing tasks are integrated into a single device, to overcome the drawbacks of performing these operations separately

Disco Automatic Grinder Model 810 - Packaging Equipment ,

Disco Automatic Grinder Model 810 - Packaging Equipment ,

Description The Disco Automatic Grinder (DAG 810) Model 810 is a single-spindle/single-chuck-table unit that performs back-side grinding on sampl

Disco Back Grinding Machines | Products & Suppliers ,

Disco Back Grinding Machines | Products & Suppliers ,

Metal Cutting Corporation 7 Fundamentals of the Centerless Grinding Process 7 Fundamentals of the Centerless Grinding Process Where Machining Ends, Centerless Grinding Begins In the machining world, turning gets all the attention Lathes and mills are the flashy stars -- in fact, they ARE machining to most people However, the centerless grinding process is also very important

Used Disco Corporation Equipment | Buy & Sell | EquipNet

Used Disco Corporation Equipment | Buy & Sell | EquipNet

Disco Wafer Die Saws Disco Corporation manufactures a wide range of fully automatic and automatic Wafer Die Saw for cutting semiconductor wafers EquipNet carries a range of used Disco Corporation equipment, including fully automatic dicing saws

DISCO Corporation

DISCO Corporation

Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipmentInvestor relations, careers, and DISCO corporate ,

Solutions Support | Dicing and Grinding Service - DISCO ,

Solutions Support | Dicing and Grinding Service - DISCO ,

This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai) and DISCO HI-TEC AMERICA(San Jose) It is also possible to provide these services with machines that are not shown here

DISCO Corporation | SEMIORG

DISCO Corporation | SEMIORG

Dicing equipment; grinding equipment and related consumables for materials processing

Applied Materials and DISCO Collaborate on Wafer Thinning ,

Applied Materials and DISCO Collaborate on Wafer Thinning ,

Mar 30, 2009· DISCO Corporation (TOKYO:6146) provides equipment and process solutions to the semiconductor and electronics industries utilizing our core technologies of kiru (cutting), kezuru (grinding), and .

DISCO CORPORATION Annual Report 2000

DISCO CORPORATION Annual Report 2000

TO OUR SHAREHOLDERS 2 DISCO CORPORATION ANNUAL REPORT 2000 World Leadership Position in Precision Systems Products-“Kiru” (cutting), “Kezuru” (grinding) and “Migaku” (polishing) technologies DISCO’S PRECISION SYSTEMS PRODUCTS HOLD TOP SHARE IN THE WORLD

DISCO CORP Registered Shares o (D65SG) Company Profile ,

DISCO CORP Registered Shares o (D65SG) Company Profile ,

See the company profile for DISCO CORP Registered Shares o (D65SG) including business summary, industry/sector information, number of employees, business summary, corporate governance, key .

Disco Corporation - Wikipedia

Disco Corporation - Wikipedia

DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage .

disco corporation equipment for qrindinq of

disco corporation equipment for qrindinq of

disco corporation equipment for qrindinq of crusherasia DISCO Corporation Manufacturer of precision dicing saws and grinding wheels providing dicing, grinding, and polishing equipment and services for semiconductor and electronic components Get price

DSCSYPK - DISCO CORPORATION Profile | Reuters

DSCSYPK - DISCO CORPORATION Profile | Reuters

DISCO CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools, as ,

DISCO Corporation Company Profile - Office Locations ,

DISCO Corporation Company Profile - Office Locations ,

Disco Corporation manufactures and sells precision cutting, grinding, and polishing machin The Company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation

disco corporation equipment for qrindinq of

disco corporation equipment for qrindinq of

disco corporation equipment for qrindinq of KABRA|DISCO Corporation This ingot slicing method forms a flat light-absorbing separation layer (KABRA layer *2) at a specified depth by irradiating a continuous, vertical laser from the upper surface of the SiC ingot, producing wafers Conventional laser processing is not suitable for slicing .

DISCO CORPORATION : Shareholders Board Members Managers ,

DISCO CORPORATION : Shareholders Board Members Managers ,

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KABRA|DISCO Corporation

KABRA|DISCO Corporation

This ingot slicing method forms a flat light-absorbing separation layer (KABRA layer *2) at a specified depth by irradiating a continuous, vertical laser from the upper surface of the SiC ingot, producing wafers Conventional laser processing is not suitable for slicing because the modified layer formed by laser irradiation, in principle, extends in the direction of the laser incident (vertical)

6146T - DISCO CORPORATION Profile | Reuters

6146T - DISCO CORPORATION Profile | Reuters

About DISCO CORPORATION DISCO CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools, as well as the .

Stock | DISCO Stock Price Today | Markets Insider

Stock | DISCO Stock Price Today | Markets Insider

DISCO Corp engages in the manufacturing and sale of precision processing equipment It operates through the following business divisions: Precision Machines, Precision Processing Tools, and Other .

Product Information | Grinding Wheels - DISCO Corporation

Product Information | Grinding Wheels - DISCO Corporation

DISCO's grinding wheels grind silicon, compound semiconductors, crystals, and a wide variety of other materials They are an essential part of DISCO's excellent Kezuru (Grinding) solutions

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